HEAT SINK, STAMPING, TO-218, 44. | CUI Devices
Heat Sink TO-218 Aluminum Alloy 10.3W @ 75°C Board Level, Vertical
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Unit Price ($ / pc.)
0.688945 $
*
Available: 195 pcs.
Next delivery: 3045 pcs.
Manufacturer Leadtime: 16 Weeks **
Description
The HSS08-B18-CP is a common industry Heat Sinks housed in a RoHS compliant Standar package by CUI Devices made. The HSS08-B18-CP is using SPQ 1000 pieces and MSL1 packing size. Buy new and original item from Innovo Technology distributor, contact by email: sales@hk-innovo.com
Technical specifications
Mfr | CUI Devices |
Series | HSS |
Package | Box |
Product Status | Active |
Type | Board Level, Vertical |
Package Cooled | TO-218 |
Attachment Method | PC Pin |
Shape | Square |
Length | 1.750" (44.45mm) |
Width | 1.750" (44.45mm) |
Diameter | - |
Fin Height | 0.492" (12.50mm) |
Power Dissipation @ Temperature Rise | 10.3W @ 75°C |
Thermal Resistance @ Forced Air Flow | 3.50°C/W @ 200 LFM |
Thermal Resistance @ Natural | 7.29°C/W |
Material | Aluminum Alloy |
Material Finish | Black Anodized |
Logistics
Country of origin | HK |
Customs tariff number | - |
Original Packaging | Reel with 1000 pieces |
Compliance
RoHS conform | Yes |
HTSUS | 8504.40.9580 |
SVHC free | Yes |
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HSS08-B18-CP specification