HEAT SINK, STAMPING, TO-220, 21. | CUI Devices
Heat Sink TO-220 Copper Alloy 2.5W @ 75°C Board Level, Vertical
Images may differ
Unit Price ($ / pc.)
0.45268 $
*
Available: 195 pcs.
Next delivery: 3045 pcs.
Manufacturer Leadtime: 16 Weeks **
Description
The HSS07-C20-P274 is a common industry Heat Sinks housed in a RoHS compliant Standar package by CUI Devices made. The HSS07-C20-P274 is using SPQ 2000 pieces and MSL1 packing size. Buy new and original item from Innovo Technology distributor, contact by email: sales@hk-innovo.com
Technical specifications
Mfr | CUI Devices |
Series | HSS |
Package | Box |
Product Status | Active |
Type | Board Level, Vertical |
Package Cooled | TO-220 |
Attachment Method | PC Pin |
Shape | Rectangular |
Length | 0.853" (21.66mm) |
Width | 0.520" (13.21mm) |
Diameter | - |
Fin Height | 0.515" (13.08mm) |
Power Dissipation @ Temperature Rise | 2.5W @ 75°C |
Thermal Resistance @ Forced Air Flow | 12.60°C/W @ 200 LFM |
Thermal Resistance @ Natural | 29.57°C/W |
Material | Copper Alloy |
Material Finish | Tin |
Logistics
Country of origin | HK |
Customs tariff number | - |
Original Packaging | Reel with 2000 pieces |
Compliance
RoHS conform | Yes |
HTSUS | 8504.40.9580 |
SVHC free | Yes |
Search
HSS07-C20-P274 ECAD module
HSS07-C20-P274 specification
HSS07-C20-P274 certificate
HSS07-C20-P274 substitute