HEAT SINK, BGA, 12 X 12 X 18 MM | CUI Devices

Heat Sink BGA Aluminum Alloy 3.1W @ 75°C Top Mount

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Unit Price ($ / pc.)
0.30189 $ *
Available: 195 pcs.
Next delivery: 3045 pcs.
Available in 1 Weeks
Manufacturer Leadtime: 16 Weeks **
Quantity
Price per unit*
100 pcs.
0.286796 $
500 pcs.
0.271701 $
1000 pcs.
0.256607 $
3000 pcs.
0.241512 $
10000 pcs.
0.226418 $
*incl. VAT plus shipping costs
**Subject to prior sale
Description

The HSB03-121218 is a common industry Heat Sinks housed in a RoHS compliant Standar package by CUI Devices made. The HSB03-121218 is using SPQ 2520 pieces and MSL1 packing size. Buy new and original item from Innovo Technology distributor, contact by email: sales@hk-innovo.com

Technical specifications
MfrCUI Devices
SeriesHSB
PackageTray
Product StatusActive
TypeTop Mount
Package CooledBGA
Attachment MethodAdhesive
ShapeSquare, Pin Fins
Length0.472" (12.00mm)
Width0.472" (12.00mm)
Diameter-
Fin Height0.709" (18.00mm)
Power Dissipation @ Temperature Rise3.1W @ 75°C
Thermal Resistance @ Forced Air Flow9.60°C/W @ 200 LFM
Thermal Resistance @ Natural24.01°C/W
MaterialAluminum Alloy
Material FinishBlack Anodized
Logistics
Country of originHK
Customs tariff number-
Original PackagingReel with 2520 pieces
Compliance
RoHS conformYes
HTSUS8504.40.9580
SVHC freeYes
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HSS13-B20-NP