HEAT SINK, BGA, 27 X 27 X 18 MM | CUI Devices
Heat Sink BGA Aluminum Alloy 6.8W @ 75°C Top Mount
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Unit Price ($ / pc.)
0.64971 $
*
Available: 195 pcs.
Next delivery: 3045 pcs.
Available in 1 Weeks
Manufacturer Leadtime: 16 Weeks **
Quantity
Price per unit*
100 pcs.
0.617225 $
500 pcs.
0.584739 $
1000 pcs.
0.552254 $
3000 pcs.
0.519768 $
10000 pcs.
0.487283 $
*incl. VAT plus
shipping costs
**Subject to prior sale
Description
The HSB19-272718 is a common industry Heat Sinks housed in a RoHS compliant Standar package by CUI Devices made. The HSB19-272718 is using SPQ 660 pieces and MSL1 packing size. Buy new and original item from Innovo Technology distributor, contact by email: sales@hk-innovo.com
Technical specifications
| Mfr | CUI Devices |
| Series | HSB |
| Package | Box |
| Product Status | Active |
| Type | Top Mount |
| Package Cooled | BGA |
| Attachment Method | Adhesive |
| Shape | Square, Pin Fins |
| Length | 1.063" (27.00mm) |
| Width | 1.063" (27.00mm) |
| Diameter | - |
| Fin Height | 0.709" (18.00mm) |
| Power Dissipation @ Temperature Rise | 6.8W @ 75°C |
| Thermal Resistance @ Forced Air Flow | 4.50°C/W @ 200 LFM |
| Thermal Resistance @ Natural | 11.11°C/W |
| Material | Aluminum Alloy |
| Material Finish | Black Anodized |
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Logistics
| Country of origin | HK |
| Customs tariff number | - |
| Original Packaging | Reel with 660 pieces |
Compliance
| RoHS conform | Yes |
| HTSUS | 8504.40.9580 |
| SVHC free | Yes |
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