HEAT SINK, BGA, 20 X 20 X 9 MM | CUI Devices
Heat Sink BGA Aluminum Alloy 3.1W @ 75°C Top Mount
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Unit Price ($ / pc.)
0.28068 $
*
Available: 195 pcs.
Next delivery: 3045 pcs.
Available in 1 Weeks
Manufacturer Leadtime: 16 Weeks **
Quantity
Price per unit*
100 pcs.
0.266646 $
500 pcs.
0.252612 $
1000 pcs.
0.238578 $
3000 pcs.
0.224544 $
10000 pcs.
0.21051 $
*incl. VAT plus
shipping costs
**Subject to prior sale
Description
The HSB07-202009 is a common industry Heat Sinks housed in a RoHS compliant Standar package by CUI Devices made. The HSB07-202009 is using SPQ 1872 pieces and MSL1 packing size. Buy new and original item from Innovo Technology distributor, contact by email: sales@hk-innovo.com
Technical specifications
| Mfr | CUI Devices |
| Series | HSB |
| Package | Box |
| Product Status | Active |
| Type | Top Mount |
| Package Cooled | BGA |
| Attachment Method | Adhesive |
| Shape | Square, Pin Fins |
| Length | 0.787" (20.00mm) |
| Width | 0.787" (20.00mm) |
| Diameter | - |
| Fin Height | 0.354" (9.00mm) |
| Power Dissipation @ Temperature Rise | 3.1W @ 75°C |
| Thermal Resistance @ Forced Air Flow | 8.60°C/W @ 200 LFM |
| Thermal Resistance @ Natural | 24.08°C/W |
| Material | Aluminum Alloy |
| Material Finish | Black Anodized |
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Logistics
| Country of origin | HK |
| Customs tariff number | - |
| Original Packaging | Reel with 1872 pieces |
Compliance
| RoHS conform | Yes |
| HTSUS | 8504.40.9580 |
| SVHC free | Yes |
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