NOW WEEN - BYV25FD-600 - ULTRAFA | NXP USA Inc.
Diode 600 V 5A Surface Mount DPAK
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Unit Price ($ / pc.)
0.16 $
*
Available: 184 pcs.
Next delivery: 2814 pcs.
Manufacturer Leadtime: **
Description
The BYV25FD-600,118 is a common industry Single Diodes housed in a RoHS compliant TO-252-3, DPAK (2 Leads + Tab), SC-63 package by NXP USA Inc. made. The BYV25FD-600,118 is using SPQ 944 pieces and MSL1 packing size. Buy new and original item from Innovo Technology distributor, contact by email: sales@hk-innovo.com
Technical specifications
| Mfr | NXP USA Inc. |
| Series | - |
| Package | Bulk |
| Product Status | Active |
| Technology | Standard |
| Voltage - DC Reverse (Vr) (Max) | 600 V |
| Current - Average Rectified (Io) | 5A |
| Voltage - Forward (Vf) (Max) @ If | 1.9 V @ 5 A |
| Speed | Fast Recovery =< 500ns, > 200mA (Io) |
| Reverse Recovery Time (trr) | 35 ns |
| Current - Reverse Leakage @ Vr | 50 μA @ 600 V |
| Capacitance @ Vr, F | - |
| Mounting Type | Surface Mount |
| Package / Case | TO-252-3, DPAK (2 Leads + Tab), SC-63 |
| Supplier Device Package | DPAK |
| Operating Temperature - Junction | 150°C (Max) |
Logistics
| Country of origin | HK |
| Customs tariff number | - |
| Original Packaging | Reel with 944 pieces |
Compliance
| RoHS conform | Yes |
| HTSUS | 8504.40.9580 |
| SVHC free | Yes |
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BYV25FD-600,118 ECAD module
BYV25FD-600,118 datesheet
BYV25FD-600,118 specification
BYV25FD-600,118 certificate
BYV25FD-600,118 component
BYV25FD-600,118 substitute
BYV25FD-600,118 packaging