PM-IGBT-TFS-SBD~-SP1F | Microchip Technology

IGBT Module Trench Half Bridge 650 V 80 A Chassis Mount SP1

default L
Images may differ 
Unit Price ($ / pc.)
54.74375 $ *
Available: 173 pcs.
Next delivery: 2583 pcs.
Available in 1 Weeks
Manufacturer Leadtime: 37 Weeks **
Quantity
Price per unit*
100 pcs.
52.006563 $
500 pcs.
49.269375 $
1000 pcs.
46.532188 $
3000 pcs.
43.795 $
10000 pcs.
41.057813 $
*incl. VAT plus shipping costs
**Subject to prior sale
Description

The MSCGTQ100HD65C1AG is a common industry IGBT Modules housed in a RoHS compliant Module package by Microchip Technology made. The MSCGTQ100HD65C1AG is using SPQ 1 pieces and MSL1 packing size. Buy new and original item from Innovo Technology distributor, contact by email: sales@hk-innovo.com

Technical specifications
MfrMicrochip Technology
SeriesMSC
PackageTube
Product StatusActive
IGBT TypeTrench
ConfigurationHalf Bridge
Voltage - Collector Emitter Breakdown (Max)650 V
Current - Collector (Ic) (Max)80 A
Vce(on) (Max) @ Vge, Ic-
Current - Collector Cutoff (Max)80 A
InputStandard
NTC ThermistorNo
Operating Temperature-
Mounting TypeChassis Mount
Package / CaseModule
Supplier Device PackageSP1
Base Product NumberMSCGTQ100
Logistics
Country of originHK
Customs tariff number-
Original PackagingReel with 1 pieces
Compliance
RoHS conformYes
HTSUS8504.40.9580
SVHC freeYes