PM-IGBT-TFS-SBD~-SP1F | Microchip Technology
IGBT Module Trench Half Bridge 650 V 80 A Chassis Mount SP1
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Unit Price ($ / pc.)
54.74375 $
*
Available: 173 pcs.
Next delivery: 2583 pcs.
Manufacturer Leadtime: 37 Weeks **
Description
The MSCGTQ100HD65C1AG is a common industry IGBT Modules housed in a RoHS compliant Module package by Microchip Technology made. The MSCGTQ100HD65C1AG is using SPQ 1 pieces and MSL1 packing size. Buy new and original item from Innovo Technology distributor, contact by email: sales@hk-innovo.com
Technical specifications
| Mfr | Microchip Technology |
| Series | MSC |
| Package | Tube |
| Product Status | Active |
| IGBT Type | Trench |
| Configuration | Half Bridge |
| Voltage - Collector Emitter Breakdown (Max) | 650 V |
| Current - Collector (Ic) (Max) | 80 A |
| Vce(on) (Max) @ Vge, Ic | - |
| Current - Collector Cutoff (Max) | 80 A |
| Input | Standard |
| NTC Thermistor | No |
| Operating Temperature | - |
| Mounting Type | Chassis Mount |
| Package / Case | Module |
| Supplier Device Package | SP1 |
| Base Product Number | MSCGTQ100 |
Logistics
| Country of origin | HK |
| Customs tariff number | - |
| Original Packaging | Reel with 1 pieces |
Compliance
| RoHS conform | Yes |
| HTSUS | 8504.40.9580 |
| SVHC free | Yes |
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