BGA SURFACE MOUNT 1.27MM | Preci-Dip

360 (19 x 19) Pos BGA Socket Gold Surface Mount

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Unit Price ($ / pc.)
23.75545 $ *
Available: 461 pcs.
Next delivery: 8631 pcs.
Available in 4 Weeks
Manufacturer Leadtime: 20 Weeks **
Quantity
Price per unit*
100 pcs.
22.567678 $
500 pcs.
21.379905 $
1000 pcs.
20.192133 $
3000 pcs.
19.00436 $
10000 pcs.
17.816588 $
*incl. VAT plus shipping costs
**Subject to prior sale
Description

The 558-10-360M19-001104 is a common industry IC Sockets housed in a RoHS compliant Standar package by Preci-Dip made. The 558-10-360M19-001104 is using SPQ 21 pieces and MSL1 packing size. Buy new and original item from Innovo Technology distributor, contact by email: sales@hk-innovo.com

Technical specifications
MfrPreci-Dip
Series558
PackageBulk
Product StatusActive
TypeBGA
Number of Positions or Pins (Grid)360 (19 x 19)
Pitch - Mating0.050 (1.27mm)
Contact Finish - MatingGold
Contact Finish Thickness - Mating10.0μin (0.25μm)
Contact Material - MatingBrass
Mounting TypeSurface Mount
FeaturesClosed Frame
TerminationSolder
Pitch - Post0.050 (1.27mm)
Contact Finish - PostGold
Contact Finish Thickness - Post10.0μin (0.25μm)
Contact Material - PostBrass
Housing MaterialFR4 Epoxy Glass
Operating Temperature-55°C ~ 125°C
Termination Post Length0.086 (2.20mm)
Material Flammability RatingUL94 V-0
Current Rating (Amps)1 A
Contact Resistance10mOhm
Base Product Number558-10
Logistics
Country of originHK
Customs tariff number-
Original PackagingReel with 21 pieces
Compliance
RoHS conformYes
HTSUS8504.40.9580
SVHC freeYes