IC MAGN FIELD SENSOR DBL DIE | NXP USA Inc.
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Unit Price ($ / pc.)
$
*
Available: 393 pcs.
Next delivery: 7203 pcs.
Available in 3 Weeks
Manufacturer Leadtime: **
Quantity
Price per unit*
100 pcs.
0 $
500 pcs.
0 $
1000 pcs.
0 $
3000 pcs.
0 $
10000 pcs.
0 $
*incl. VAT plus
shipping costs
**Subject to prior sale
Description
The X3T-OH047,135 is a common industry Unclassified housed in a RoHS compliant Standar package by NXP USA Inc. made. The X3T-OH047,135 is using SPQ 4500 pieces and MSL1 packing size. Buy new and original item from Innovo Technology distributor, contact by email: sales@hk-innovo.com
Technical specifications
| Mfr | NXP USA Inc. |
| Series | * |
| Package | Tape & Reel (TR) |
| Product Status | Active |
| Base Product Number | X3T-OH047 |
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Logistics
| Country of origin | HK |
| Customs tariff number | - |
| Original Packaging | Reel with 4500 pieces |
Compliance
| RoHS conform | Yes |
| HTSUS | 8504.40.9580 |
| SVHC free | Yes |
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