IC MPU POWERQUICC II PRO 516PBGA | NXP USA Inc.

Microprocessor IC * 516-TEPBGA (27x27)

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Unit Price ($ / pc.)
23.700875 $ *
Available: 331 pcs.
Next delivery: 5901 pcs.
Available in 2 Weeks
Manufacturer Leadtime: 52 Weeks **
Quantity
Price per unit*
100 pcs.
22.515831 $
500 pcs.
21.330788 $
1000 pcs.
20.145744 $
3000 pcs.
18.9607 $
10000 pcs.
17.775656 $
*incl. VAT plus shipping costs
**Subject to prior sale
Description

The MPC8313EVRAGDC is a common industry Microprocessors housed in a RoHS compliant 516-BBGA Exposed Pad package by NXP USA Inc. made. The MPC8313EVRAGDC is using SPQ 40 pieces and MSL1 packing size. Buy new and original item from Innovo Technology distributor, contact by email: sales@hk-innovo.com

Technical specifications
MfrNXP USA Inc.
Series*
PackageTray
Product StatusActive
Mounting TypeSurface Mount
Package / Case516-BBGA Exposed Pad
Supplier Device Package516-TEPBGA (27x27)
Base Product NumberMPC8313
Logistics
Country of originHK
Customs tariff number-
Original PackagingReel with 40 pieces
Compliance
RoHS conformYes
HTSUS8504.40.9580
SVHC freeYes