IC FPGA 469 I/O 676FBGA | AMD

Spartan-3A DSP Field Programmable Gate Array (FPGA) IC 469 2322432 53712 676-BGA

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MPN: XC3SD3400A-4FGG676C

ManufacturerAMD
Innovo Part NO.XC3SD3400A-4FGG676C_1756098
SeriesSpartan-3A DSP
Package / Case676-BGA
SPQ.40
Moisture Sensitivity LevelMSL 1
CertificateCE, CCC, ROHS
Product StatusAvailable
CategoriesIntegrated Circuits (ICs) >> Embedded >> FPGAs (Field Programmable Gate Array)
Technical specifications Download Datasheet
Unit Price ($ / pc.)
70.85 $ *
Available: 225 pcs.
Next delivery: 3675 pcs.
Available in 1 Weeks
Manufacturer Leadtime: **
Quantity
Price per unit*
100 pcs.
67.3075 $
500 pcs.
63.765 $
1000 pcs.
60.2225 $
3000 pcs.
56.68 $
10000 pcs.
53.1375 $
*incl. VAT plus shipping costs
**Subject to prior sale
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Description
Technical specifications
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Logistics
Compliance
Description

The XC3SD3400A-4FGG676C is a common industry FPGAs (Field Programmable Gate Array) housed in a RoHS compliant 676-BGA package by AMD made. The XC3SD3400A-4FGG676C is using SPQ 40 pieces and MSL1 packing size. Buy new and original item from Innovo Technology distributor, contact by email: sales@hk-innovo.com

Technical specifications
MfrAMD
SeriesSpartan-3A DSP
PackageTray
Product StatusLast Time Buy
ProgrammableNot Verified
Number of LABs/CLBs5968
Number of Logic Elements/Cells53712
Total RAM Bits2322432
Number of I/O469
Number of Gates3400000
Voltage - Supply1.14V ~ 1.26V
Mounting TypeSurface Mount
Operating Temperature0°C ~ 85°C (TJ)
Package / Case676-BGA
Supplier Device Package676-FBGA (27x27)
Base Product NumberXC3SD3400
Logistics
Country of originHK
Customs tariff number-
Original PackagingReel with 40 pieces
Compliance
RoHS conformYes
HTSUS8504.40.9580
SVHC freeYes