IC FPGA 65 I/O 180QFN | Microsemi Corporation
Fusion Field Programmable Gate Array (FPGA) IC 65 36864 180-WFQFN Dual Rows, Exposed Pad
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Available: 336 pcs.
Next delivery: 6006 pcs.
Manufacturer Leadtime: **
Description
The M1AFS250-QNG180 is a common industry FPGAs (Field Programmable Gate Array) housed in a RoHS compliant 180-WFQFN Dual Rows, Exposed Pad package by Microsemi Corporation made. The M1AFS250-QNG180 is using SPQ 184 pieces and MSL1 packing size. Buy new and original item from Innovo Technology distributor, contact by email: sales@hk-innovo.com
Technical specifications
| Mfr | Microsemi Corporation |
| Series | Fusion |
| Package | Tray |
| Product Status | Obsolete |
| Programmable | Not Verified |
| Total RAM Bits | 36864 |
| Number of I/O | 65 |
| Number of Gates | 250000 |
| Voltage - Supply | 1.425V ~ 1.575V |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) |
| Package / Case | 180-WFQFN Dual Rows, Exposed Pad |
| Supplier Device Package | 180-QFN (10x10) |
| Base Product Number | M1AFS250 |
Logistics
| Country of origin | HK |
| Customs tariff number | - |
| Original Packaging | Reel with 184 pieces |
Compliance
| RoHS conform | Yes |
| HTSUS | 8504.40.9580 |
| SVHC free | Yes |
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M1AFS250-QNG180 ECAD module
M1AFS250-QNG180 datesheet
M1AFS250-QNG180 specification
M1AFS250-QNG180 certificate
M1AFS250-QNG180 component
M1AFS250-QNG180 substitute
M1AFS250-QNG180 packaging