IC FPGA 260 I/O 352MBGA | AMD
Virtex-E Field Programmable Gate Array (FPGA) IC 260 131072 6912 352-LBGA Exposed Pad, Metal
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Available: 457 pcs.
Next delivery: 8547 pcs.
Manufacturer Leadtime: **
Description
The XCV300E-6BG352I is a common industry FPGAs (Field Programmable Gate Array) housed in a RoHS compliant 352-LBGA Exposed Pad, Metal package by AMD made. The XCV300E-6BG352I is using SPQ 24 pieces and MSL1 packing size. Buy new and original item from Innovo Technology distributor, contact by email: sales@hk-innovo.com
Technical specifications
Mfr | AMD |
Series | Virtex-E |
Package | Tray |
Product Status | Obsolete |
Programmable | Not Verified |
Number of LABs/CLBs | 1536 |
Number of Logic Elements/Cells | 6912 |
Total RAM Bits | 131072 |
Number of I/O | 260 |
Number of Gates | 411955 |
Voltage - Supply | 1.71V ~ 1.89V |
Mounting Type | Surface Mount |
Operating Temperature | -40°C ~ 100°C (TJ) |
Package / Case | 352-LBGA Exposed Pad, Metal |
Supplier Device Package | 352-MBGA (35x35) |
Base Product Number | XCV300E |
Logistics
Country of origin | HK |
Customs tariff number | - |
Original Packaging | Reel with 24 pieces |
Compliance
RoHS conform | Yes |
HTSUS | 8504.40.9580 |
SVHC free | Yes |
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XCV300E-6BG352I ECAD module
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XCV300E-6BG352I specification
XCV300E-6BG352I certificate
XCV300E-6BG352I component
XCV300E-6BG352I substitute
XCV300E-6BG352I packaging