IC DSP ARM SOC BGA | Texas Instruments
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Available: 550 pcs.
Next delivery: 10500 pcs.
Manufacturer Leadtime: **
Description
The X66AK2E05XABD25 is a common industry DSP (Digital Signal Processors) housed in a RoHS compliant 1089-BFBGA, FCBGA package by Texas Instruments made. The X66AK2E05XABD25 is using SPQ 40 pieces and MSL1 packing size. Buy new and original item from Innovo Technology distributor, contact by email: sales@hk-innovo.com
Technical specifications
| Mfr | Texas Instruments |
| Series | 66AK2Ex KeyStone Multicore |
| Package | Tube |
| Product Status | Obsolete |
| Type | DSP+ARM |
| Interface | EBI/EMI, Ethernet, DMA, I2C, PCIe, SPI, TSIP, UART, USB 3.0, USIM |
| Clock Rate | 1.25GHz |
| Non-Volatile Memory | ROM (256kB) |
| On-Chip RAM | 2MB |
| Voltage - I/O | 1.35V, 1.5V, 1.8V, 3.3V |
| Voltage - Core | Variable |
| Operating Temperature | 0°C ~ 85°C (TC) |
| Mounting Type | Surface Mount |
| Package / Case | 1089-BFBGA, FCBGA |
| Supplier Device Package | 1089-FCBGA (27x27) |
| Base Product Number | X66AK2 |
Logistics
| Country of origin | HK |
| Customs tariff number | - |
| Original Packaging | Reel with 40 pieces |
Compliance
| RoHS conform | Yes |
| HTSUS | 8504.40.9580 |
| SVHC free | Yes |
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X66AK2E05XABD25 ECAD module
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X66AK2E05XABD25 component
X66AK2E05XABD25 substitute
X66AK2E05XABD25 packaging