INTEGRATED CIRCUIT | NXP USA Inc.
Telecom IC
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Unit Price ($ / pc.)
0.432 $
*
Available: 181 pcs.
Next delivery: 2751 pcs.
Manufacturer Leadtime: **
Description
The TDA18225HN/C1 is a common industry Telecom housed in a RoHS compliant - package by NXP USA Inc. made. The TDA18225HN/C1 is using SPQ 938 pieces and MSL1 packing size. Buy new and original item from Innovo Technology distributor, contact by email: sales@hk-innovo.com
Technical specifications
Mfr | NXP USA Inc. |
Series | - |
Package | Bulk |
Product Status | Obsolete |
Function | - |
Interface | - |
Voltage - Supply | - |
Current - Supply | - |
Operating Temperature | - |
Mounting Type | - |
Package / Case | - |
Supplier Device Package | - |
Logistics
Country of origin | HK |
Customs tariff number | - |
Original Packaging | Reel with 938 pieces |
Compliance
RoHS conform | Yes |
HTSUS | 8504.40.9580 |
SVHC free | Yes |
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TDA18225HN/C1 ECAD module
TDA18225HN/C1 specification
TDA18225HN/C1 certificate