IC TELECOM INTERFACE 256BGA | Infineon Technologies
Telecom IC 256-L2BGA (27x27)
Images may differ 
Unit Price ($ / pc.)
$
*
Available: 233 pcs.
Next delivery: 3843 pcs.
Available in 1 Weeks
Manufacturer Leadtime: **
Quantity
Price per unit*
100 pcs.
0 $
500 pcs.
0 $
1000 pcs.
0 $
3000 pcs.
0 $
10000 pcs.
0 $
*incl. VAT plus
shipping costs
**Subject to prior sale
Description
The CYP15G0402DXB-BGXC is a common industry Telecom housed in a RoHS compliant 256-BGA Exposed Pad package by Infineon Technologies made. The CYP15G0402DXB-BGXC is using SPQ 40 pieces and MSL1 packing size. Buy new and original item from Innovo Technology distributor, contact by email: sales@hk-innovo.com
Technical specifications
| Mfr | Infineon Technologies |
| Series | HOTlink II |
| Package | Tray |
| Product Status | Obsolete |
| Function | - |
| Interface | LVTTL |
| Number of Circuits | 4 |
| Voltage - Supply | 3.135V ~ 3.465V |
| Current - Supply | 830mA |
| Operating Temperature | 0°C ~ 70°C |
| Mounting Type | Surface Mount |
| Package / Case | 256-BGA Exposed Pad |
| Supplier Device Package | 256-L2BGA (27x27) |
| Base Product Number | CYP15G0402 |
Download
Logistics
| Country of origin | HK |
| Customs tariff number | - |
| Original Packaging | Reel with 40 pieces |
Compliance
| RoHS conform | Yes |
| HTSUS | 8504.40.9580 |
| SVHC free | Yes |
Search