IC TELECOM INTERFACE 256BGA | Infineon Technologies
Telecom IC 256-L2BGA (27x27)
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Unit Price ($ / pc.)
41.175 $
*
Available: 233 pcs.
Next delivery: 3843 pcs.
Available in 1 Weeks
Manufacturer Leadtime: **
Quantity
Price per unit*
100 pcs.
39.11625 $
500 pcs.
37.0575 $
1000 pcs.
34.99875 $
3000 pcs.
32.94 $
10000 pcs.
30.88125 $
*incl. VAT plus
shipping costs
**Subject to prior sale
Description
The CYW15G0403DXB-BGI is a common industry Telecom housed in a RoHS compliant 256-BGA Exposed Pad package by Infineon Technologies made. The CYW15G0403DXB-BGI is using SPQ 40 pieces and MSL1 packing size. Buy new and original item from Innovo Technology distributor, contact by email: sales@hk-innovo.com
Technical specifications
| Mfr | Infineon Technologies |
| Series | HOTlink II |
| Package | Tray |
| Product Status | Obsolete |
| Function | - |
| Interface | - |
| Number of Circuits | 4 |
| Voltage - Supply | 3.135V ~ 3.465V |
| Current - Supply | - |
| Operating Temperature | - |
| Mounting Type | Surface Mount |
| Package / Case | 256-BGA Exposed Pad |
| Supplier Device Package | 256-L2BGA (27x27) |
| Base Product Number | CYW15G0403 |
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Logistics
| Country of origin | HK |
| Customs tariff number | - |
| Original Packaging | Reel with 40 pieces |
Compliance
| RoHS conform | Yes |
| HTSUS | 8504.40.9580 |
| SVHC free | Yes |
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