IC TELECOM INTERFACE 676TEPBGA | Analog Devices Inc./Maxim Integrated
Telecom IC TDM-over-Packet (TDMoP) 676-TEPBGA (27x27)
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Unit Price ($ / pc.)
$
*
Available: 447 pcs.
Next delivery: 8337 pcs.
Available in 3 Weeks
Manufacturer Leadtime: **
Quantity
Price per unit*
100 pcs.
0 $
500 pcs.
0 $
1000 pcs.
0 $
3000 pcs.
0 $
10000 pcs.
0 $
*incl. VAT plus
shipping costs
**Subject to prior sale
Description
The DS34S132GN is a common industry Telecom housed in a RoHS compliant 676-BGA package by Analog Devices Inc./Maxim Integrated made. The DS34S132GN is using SPQ 1 pieces and MSL1 packing size. Buy new and original item from Innovo Technology distributor, contact by email: sales@hk-innovo.com
Technical specifications
| Mfr | Analog Devices Inc./Maxim Integrated |
| Series | - |
| Package | Tray |
| Product Status | Obsolete |
| Function | TDM-over-Packet (TDMoP) |
| Interface | TDMoP |
| Number of Circuits | 1 |
| Voltage - Supply | 1.8V, 3.3V |
| Current - Supply | - |
| Operating Temperature | -40°C ~ 85°C |
| Mounting Type | Surface Mount |
| Package / Case | 676-BGA |
| Supplier Device Package | 676-TEPBGA (27x27) |
| Base Product Number | DS34S132 |
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Logistics
| Country of origin | HK |
| Customs tariff number | - |
| Original Packaging | Reel with 1 pieces |
Compliance
| RoHS conform | Yes |
| HTSUS | 8504.40.9580 |
| SVHC free | Yes |
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