IC SBC CAN HIGH SPEED 20HVSON | NXP USA Inc.
System Basis Chip Interface 20-HVSON (3.5x5.5)
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Unit Price ($ / pc.)
1.087135 $
*
Available: 177 pcs.
Next delivery: 2667 pcs.
Manufacturer Leadtime: 52 Weeks **
Description
The UJA1169ATK/F/3 is a common industry Specialized housed in a RoHS compliant 20-VFDFN Exposed Pad package by NXP USA Inc. made. The UJA1169ATK/F/3 is using SPQ 1 pieces and MSL1 packing size. Buy new and original item from Innovo Technology distributor, contact by email: sales@hk-innovo.com
Technical specifications
Mfr | NXP USA Inc. |
Series | - |
Package | Bulk |
Product Status | Active |
Applications | System Basis Chip |
Interface | CAN |
Voltage - Supply | 5V |
Package / Case | 20-VFDFN Exposed Pad |
Supplier Device Package | 20-HVSON (3.5x5.5) |
Mounting Type | Surface Mount |
Base Product Number | UJA1169 |
Logistics
Country of origin | HK |
Customs tariff number | - |
Original Packaging | Reel with 1 pieces |
Compliance
RoHS conform | Yes |
HTSUS | 8504.40.9580 |
SVHC free | Yes |
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