IC MINI-CAN SYSTEM BASIS CHIP | NXP USA Inc.
System Basis Chip Interface 20-HVSON (3.5x5.5)
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Unit Price ($ / pc.)
1.087135 $
*
Available: 184 pcs.
Next delivery: 2814 pcs.
Manufacturer Leadtime: 18 Weeks **
Description
The UJA1169ATK/F/3Z is a common industry Specialized housed in a RoHS compliant 20-VFDFN Exposed Pad package by NXP USA Inc. made. The UJA1169ATK/F/3Z is using SPQ 3000 pieces and MSL1 packing size. Buy new and original item from Innovo Technology distributor, contact by email: sales@hk-innovo.com
Technical specifications
| Mfr | NXP USA Inc. |
| Series | - |
| Package | Tape & Reel (TR) |
| Product Status | Active |
| Applications | System Basis Chip |
| Interface | CAN, SPI |
| Voltage - Supply | 3V ~ 28V |
| Package / Case | 20-VFDFN Exposed Pad |
| Supplier Device Package | 20-HVSON (3.5x5.5) |
| Mounting Type | Surface Mount |
| Base Product Number | UJA1169 |
Logistics
| Country of origin | HK |
| Customs tariff number | - |
| Original Packaging | Reel with 3000 pieces |
Compliance
| RoHS conform | Yes |
| HTSUS | 8504.40.9580 |
| SVHC free | Yes |
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UJA1169ATK/F/3Z ECAD module
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UJA1169ATK/F/3Z specification
UJA1169ATK/F/3Z certificate
UJA1169ATK/F/3Z component
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UJA1169ATK/F/3Z packaging