IC INTFACE SPECIALIZED 20HVSON | NXP USA Inc.

System Basis Chip Interface 20-HVSON (3.5x5.5)

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Unit Price ($ / pc.)
$ *
Available: 814 pcs.
Next delivery: 16044 pcs.
Available in 7 Weeks
Manufacturer Leadtime: **
Quantity
Price per unit*
100 pcs.
0 $
500 pcs.
0 $
1000 pcs.
0 $
3000 pcs.
0 $
10000 pcs.
0 $
*incl. VAT plus shipping costs
**Subject to prior sale
Description

The UJA1169LTKZ is a common industry Specialized housed in a RoHS compliant 20-VFDFN Exposed Pad package by NXP USA Inc. made. The UJA1169LTKZ is using SPQ 3000 pieces and MSL1 packing size. Buy new and original item from Innovo Technology distributor, contact by email: sales@hk-innovo.com

Technical specifications
MfrNXP USA Inc.
Series-
PackageTape & Reel (TR)
Product StatusActive
ApplicationsSystem Basis Chip
InterfaceCAN
Voltage - Supply5V
Package / Case20-VFDFN Exposed Pad
Supplier Device Package20-HVSON (3.5x5.5)
Mounting TypeSurface Mount
Base Product NumberUJA1169
Logistics
Country of originHK
Customs tariff number-
Original PackagingReel with 3000 pieces
Compliance
RoHS conformYes
HTSUS8504.40.9580
SVHC freeYes
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UJA1169LTK/XZ