IC INTFACE SPECIALIZED 30HTSSOP | Rohm Semiconductor
Interface 30-HTSSOP-B
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Unit Price ($ / pc.)
1.315765 $
*
Available: 899 pcs.
Next delivery: 17829 pcs.
Manufacturer Leadtime: 30 Weeks **
Description
The BD3376EFV-CE2 is a common industry Specialized housed in a RoHS compliant 30-VSSOP (0.220", 5.60mm Width) Exposed Pad package by Rohm Semiconductor made. The BD3376EFV-CE2 is using SPQ 2000 pieces and MSL1 packing size. Buy new and original item from Innovo Technology distributor, contact by email: sales@hk-innovo.com
Technical specifications
Mfr | Rohm Semiconductor |
Series | - |
Package | Tape & Reel (TR) |
Product Status | Active |
Applications | - |
Interface | SPI |
Voltage - Supply | 8V ~ 26V |
Package / Case | 30-VSSOP (0.220", 5.60mm Width) Exposed Pad |
Supplier Device Package | 30-HTSSOP-B |
Grade | Automotive |
Qualification | AEC-Q100 |
Mounting Type | Surface Mount |
Base Product Number | BD3376 |
Logistics
Country of origin | HK |
Customs tariff number | - |
Original Packaging | Reel with 2000 pieces |
Compliance
RoHS conform | Yes |
HTSUS | 8504.40.9580 |
SVHC free | Yes |
Search
BD3376EFV-CE2 ECAD module
BD3376EFV-CE2 specification
BD3376EFV-CE2 certificate