IC SOC CORTEX-A53 1760FCBGA | AMD
Quad ARM Cortex-A53 MPCore with CoreSight, Dual ARMCortex-R5 with CoreSight, ARM Mali-400 MP2 System On Chip (SOC) IC Zynq UltraScale+ MPSoC EG ZynqUltraScale+ FPGA, 1143K+ Logic Cells 600MHz, 667MHz, 1.5GHz 1760-FCBGA (42.5x42.5)
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Unit Price ($ / pc.)
282.5 $
*
Available: 753 pcs.
Next delivery: 14763 pcs.
Available in 7 Weeks
Manufacturer Leadtime: 16 Weeks **
Quantity
Price per unit*
100 pcs.
268.375 $
500 pcs.
254.25 $
1000 pcs.
240.125 $
3000 pcs.
226 $
10000 pcs.
211.875 $
*incl. VAT plus
shipping costs
**Subject to prior sale
Description
The XCZU19EG-3FFVC1760E is a common industry System On Chip (SoC) housed in a RoHS compliant 1760-BBGA, FCBGA package by AMD made. The XCZU19EG-3FFVC1760E is using SPQ 1 pieces and MSL1 packing size. Buy new and original item from Innovo Technology distributor, contact by email: sales@hk-innovo.com
Technical specifications
| Mfr | AMD |
| Series | Zynq UltraScale+ MPSoC EG |
| Package | Tray |
| Product Status | Active |
| Architecture | MCU, FPGA |
| Core Processor | Quad ARM Cortex-A53 MPCore with CoreSight, Dual ARMCortex-R5 with CoreSight, ARM Mali-400 MP2 |
| Flash Size | - |
| RAM Size | 256KB |
| Peripherals | DMA, WDT |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 600MHz, 667MHz, 1.5GHz |
| Primary Attributes | ZynqUltraScale+ FPGA, 1143K+ Logic Cells |
| Operating Temperature | 0°C ~ 100°C (TJ) |
| Package / Case | 1760-BBGA, FCBGA |
| Supplier Device Package | 1760-FCBGA (42.5x42.5) |
| Number of I/O | 512 |
| Base Product Number | XCZU19 |
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Logistics
| Country of origin | HK |
| Customs tariff number | - |
| Original Packaging | Reel with 1 pieces |
Compliance
| RoHS conform | Yes |
| HTSUS | 8504.40.9580 |
| SVHC free | Yes |
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