CHIRP EVALUATION MODULE CH101 | TDK InvenSense
CH101 - Ultrasonic, 3D Time-of-Flight (ToF) Sensor Evaluation Board
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Unit Price ($ / pc.)
8.73 $
*
Available: 189 pcs.
Next delivery: 2919 pcs.
Available in 1 Weeks
Manufacturer Leadtime: 28 Weeks **
Quantity
Price per unit*
100 pcs.
8.2935 $
500 pcs.
7.857 $
1000 pcs.
7.4205 $
3000 pcs.
6.984 $
10000 pcs.
6.5475 $
*incl. VAT plus
shipping costs
**Subject to prior sale
Description
The EV_MOD_CH101-01-02 is a common industry Sensor Evaluation Boards housed in a RoHS compliant Standar package by TDK InvenSense made. The EV_MOD_CH101-01-02 is using SPQ 100 pieces and MSL1 packing size. Buy new and original item from Innovo Technology distributor, contact by email: sales@hk-innovo.com
Technical specifications
| Mfr | TDK InvenSense |
| Series | - |
| Package | Tray |
| Product Status | Active |
| Sensor Type | Ultrasonic, 3D Time-of-Flight (ToF) |
| Sensing Range | 4cm ~ 1.2m |
| Interface | I2C |
| Sensitivity | - |
| Voltage - Supply | 1.62V ~ 1.98V |
| Embedded | - |
| Supplied Contents | Board(s) |
| Utilized IC / Part | CH101 |
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Logistics
| Country of origin | HK |
| Customs tariff number | - |
| Original Packaging | Reel with 100 pieces |
Compliance
| RoHS conform | Yes |
| HTSUS | 8504.40.9580 |
| SVHC free | Yes |
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