ULTRA-LOW-POWER DUAL CORE ARM CO | STMicroelectronics
IC RF TxRx + MCU 802.15.4, Bluetooth Bluetooth v5.3, Thread, Zigbee 2.405GHz ~ 2.48GHz 68-VFQFN Exposed Pad
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Unit Price ($ / pc.)
2.337105 $
*
Available: 1041 pcs.
Next delivery: 20811 pcs.
Manufacturer Leadtime: 10 Weeks **
Description
The STM32WB55RGV6 is a common industry RF Transceiver ICs housed in a RoHS compliant 68-VFQFN Exposed Pad package by STMicroelectronics made. The STM32WB55RGV6 is using SPQ 260 pieces and MSL1 packing size. Buy new and original item from Innovo Technology distributor, contact by email: sales@hk-innovo.com
Technical specifications
| Mfr | STMicroelectronics |
| Series | STM32WB |
| Package | Tray |
| Product Status | Active |
| Programmable | Not Verified |
| Type | TxRx + MCU |
| RF Family/Standard | 802.15.4, Bluetooth |
| Protocol | Bluetooth v5.3, Thread, Zigbee |
| Modulation | GFSK |
| Frequency | 2.405GHz ~ 2.48GHz |
| Data Rate (Max) | 2Mbps |
| Power - Output | 6dBm |
| Sensitivity | -100dBm |
| Memory Size | 1MB Flash, 256kB SRAM |
| Serial Interfaces | ADC, I2C, SPI, UART, USART, USB |
| GPIO | 49 |
| Voltage - Supply | 1.71V ~ 3.6V |
| Current - Receiving | 3.8mA ~ 7mA |
| Current - Transmitting | 8.1mA ~ 13.1mA |
| Operating Temperature | -40°C ~ 85°C (TA) |
| Mounting Type | Surface Mount |
| Package / Case | 68-VFQFN Exposed Pad |
| Supplier Device Package | 68-VFQFPN (8x8) |
| Base Product Number | STM32 |
Logistics
| Country of origin | HK |
| Customs tariff number | - |
| Original Packaging | Reel with 260 pieces |
Compliance
| RoHS conform | Yes |
| HTSUS | 8504.40.9580 |
| SVHC free | Yes |
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STM32WB55RGV6 ECAD module
STM32WB55RGV6 specification
STM32WB55RGV6 certificate