IC RFID TRANSP 13.56MHZ WAFER | NXP USA Inc.
RFID Transponder IC 13.56MHz ISO 15693 Die
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Unit Price ($ / pc.)
0.063125 $
*
Available: 814 pcs.
Next delivery: 16044 pcs.
Manufacturer Leadtime: 52 Weeks **
Description
The SL2S2602FUD/BGZ is a common industry RFID, RF Access, Monitoring ICs housed in a RoHS compliant Die package by NXP USA Inc. made. The SL2S2602FUD/BGZ is using SPQ 32767 pieces and MSL1 packing size. Buy new and original item from Innovo Technology distributor, contact by email: sales@hk-innovo.com
Technical specifications
Mfr | NXP USA Inc. |
Series | I-Code |
Package | Tray |
Product Status | Active |
Type | RFID Transponder |
Frequency | 13.56MHz |
Standards | ISO 15693 |
Interface | - |
Voltage - Supply | - |
Operating Temperature | - |
Mounting Type | Surface Mount |
Package / Case | Die |
Supplier Device Package | Wafer |
Base Product Number | SL2S2602 |
Logistics
Country of origin | HK |
Customs tariff number | - |
Original Packaging | Reel with 32767 pieces |
Compliance
RoHS conform | Yes |
HTSUS | 8504.40.9580 |
SVHC free | Yes |
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SL2S2602FUD/BGZ ECAD module
SL2S2602FUD/BGZ datesheet
SL2S2602FUD/BGZ specification
SL2S2602FUD/BGZ certificate
SL2S2602FUD/BGZ component
SL2S2602FUD/BGZ substitute
SL2S2602FUD/BGZ packaging