IC RFID TRANSP 840-960MHZ WAFER | NXP USA Inc.
RFID Transponder IC 840MHz ~ 960MHz EPC Die
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Unit Price ($ / pc.)
0.03556 $
*
Available: 814 pcs.
Next delivery: 16044 pcs.
Manufacturer Leadtime: 52 Weeks **
Description
The SL3S1024FUD/BG1Z is a common industry RFID, RF Access, Monitoring ICs housed in a RoHS compliant Die package by NXP USA Inc. made. The SL3S1024FUD/BG1Z is using SPQ 32767 pieces and MSL1 packing size. Buy new and original item from Innovo Technology distributor, contact by email: sales@hk-innovo.com
Technical specifications
| Mfr | NXP USA Inc. |
| Series | U-Code |
| Package | Tray |
| Product Status | Active |
| Type | RFID Transponder |
| Frequency | 840MHz ~ 960MHz |
| Standards | EPC |
| Interface | - |
| Voltage - Supply | - |
| Operating Temperature | -40°C ~ 85°C (TA) |
| Mounting Type | Surface Mount |
| Package / Case | Die |
| Supplier Device Package | Wafer |
| Base Product Number | SL3S1024 |
Logistics
| Country of origin | HK |
| Customs tariff number | - |
| Original Packaging | Reel with 32767 pieces |
Compliance
| RoHS conform | Yes |
| HTSUS | 8504.40.9580 |
| SVHC free | Yes |
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SL3S1024FUD/BG1Z ECAD module
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