IC RFID TRANSP UCODE DNA WAFER | NXP USA Inc.
RFID Transponder IC EPC, ISO 29167 Die
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Unit Price ($ / pc.)
0.13069 $
*
Available: 814 pcs.
Next delivery: 16044 pcs.
Available in 7 Weeks
Manufacturer Leadtime: 52 Weeks **
Quantity
Price per unit*
100 pcs.
0.124156 $
500 pcs.
0.117621 $
1000 pcs.
0.111087 $
3000 pcs.
0.104552 $
10000 pcs.
0.098018 $
*incl. VAT plus
shipping costs
**Subject to prior sale
Description
The SL3S5050N0FUD/00BZ is a common industry RFID, RF Access, Monitoring ICs housed in a RoHS compliant Die package by NXP USA Inc. made. The SL3S5050N0FUD/00BZ is using SPQ 32767 pieces and MSL1 packing size. Buy new and original item from Innovo Technology distributor, contact by email: sales@hk-innovo.com
Technical specifications
| Mfr | NXP USA Inc. |
| Series | U-Code |
| Package | Tray |
| Product Status | Active |
| Type | RFID Transponder |
| Frequency | - |
| Standards | EPC, ISO 29167 |
| Interface | - |
| Voltage - Supply | - |
| Operating Temperature | - |
| Mounting Type | Surface Mount |
| Package / Case | Die |
| Supplier Device Package | Wafer |
| Base Product Number | SL3S5050 |
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Logistics
| Country of origin | HK |
| Customs tariff number | - |
| Original Packaging | Reel with 32767 pieces |
Compliance
| RoHS conform | Yes |
| HTSUS | 8504.40.9580 |
| SVHC free | Yes |
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