IC RFID TRANSP UCODE DNA DIE | NXP USA Inc.
RFID Transponder IC EPC Die
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Unit Price ($ / pc.)
$
*
Available: 912 pcs.
Next delivery: 18102 pcs.
Available in 8 Weeks
Manufacturer Leadtime: **
Quantity
Price per unit*
100 pcs.
0 $
500 pcs.
0 $
1000 pcs.
0 $
3000 pcs.
0 $
10000 pcs.
0 $
*incl. VAT plus
shipping costs
**Subject to prior sale
Description
The SL3S5005N0FUD/00BZ is a common industry RFID, RF Access, Monitoring ICs housed in a RoHS compliant Die package by NXP USA Inc. made. The SL3S5005N0FUD/00BZ is using SPQ 32767 pieces and MSL1 packing size. Buy new and original item from Innovo Technology distributor, contact by email: sales@hk-innovo.com
Technical specifications
| Mfr | NXP USA Inc. |
| Series | U-Code |
| Package | Bulk |
| Product Status | Obsolete |
| Type | RFID Transponder |
| Frequency | - |
| Standards | EPC |
| Interface | - |
| Voltage - Supply | - |
| Operating Temperature | - |
| Mounting Type | Surface Mount |
| Package / Case | Die |
| Supplier Device Package | Die |
| Base Product Number | SL3S5005 |
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Logistics
| Country of origin | HK |
| Customs tariff number | - |
| Original Packaging | Reel with 32767 pieces |
Compliance
| RoHS conform | Yes |
| HTSUS | 8504.40.9580 |
| SVHC free | Yes |
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