SP,CON,3,AU,TNR | Laird Technologies EMI
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Unit Price ($ / pc.)
0.430185 $
*
Available: 492 pcs.
Next delivery: 9282 pcs.
Manufacturer Leadtime: 5 Weeks **
Description
The 67B3G2507009010R0B is a common industry RFI and EMI - Contacts, Fingerstock and Gaskets housed in a RoHS compliant Standar package by Laird Technologies EMI made. The 67B3G2507009010R0B is using SPQ 800 pieces and MSL1 packing size. Buy new and original item from Innovo Technology distributor, contact by email: sales@hk-innovo.com
Technical specifications
| Mfr | Laird Technologies EMI |
| Series | B3G |
| Package | Bulk |
| Product Status | Active |
| Type | Fingerstock |
| Shape | - |
| Width | 0.098 (2.50mm) |
| Length | 0.276 (7.00mm) |
| Height | 0.354 (9.00mm) |
| Material | Beryllium Copper |
| Plating | Gold |
| Plating - Thickness | - |
| Attachment Method | Solder |
| Operating Temperature | - |
| Shelf Life Start | - |
| Shelf Life | 12 Months |
| Storage/Refrigeration Temperature | 50°F ~ 77°F (10°C ~ 25°C) |
Logistics
| Country of origin | HK |
| Customs tariff number | - |
| Original Packaging | Reel with 800 pieces |
Compliance
| RoHS conform | Yes |
| HTSUS | 8504.40.9580 |
| SVHC free | Yes |
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