METAL FILM OVER FOAM CONTACTS | Laird Technologies EMI
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Unit Price ($ / pc.)
0.13572 $
*
Available: 591 pcs.
Next delivery: 11361 pcs.
Available in 5 Weeks
Manufacturer Leadtime: 9 Weeks **
Quantity
Price per unit*
100 pcs.
0.128934 $
500 pcs.
0.122148 $
1000 pcs.
0.115362 $
3000 pcs.
0.108576 $
10000 pcs.
0.10179 $
*incl. VAT plus
shipping costs
**Subject to prior sale
Description
The 67SLG060080070PI00 is a common industry RFI and EMI - Contacts, Fingerstock and Gaskets housed in a RoHS compliant Standar package by Laird Technologies EMI made. The 67SLG060080070PI00 is using SPQ 650 pieces and MSL1 packing size. Buy new and original item from Innovo Technology distributor, contact by email: sales@hk-innovo.com
Technical specifications
| Mfr | Laird Technologies EMI |
| Series | SMD Grounding Metallized |
| Package | Tape & Reel (TR) |
| Product Status | Active |
| Type | Film Over Foam |
| Shape | Rectangle |
| Width | 0.236" (6.00mm) |
| Length | 0.276" (7.00mm) |
| Height | 0.315" (8.00mm) |
| Material | Polyurethane Foam, Tin-Copper Polyester (SN/CU) |
| Plating | - |
| Plating - Thickness | - |
| Attachment Method | Solder |
| Operating Temperature | -40°C ~ 70°C |
| Shelf Life Start | - |
| Shelf Life | - |
| Storage/Refrigeration Temperature | - |
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Logistics
| Country of origin | HK |
| Customs tariff number | - |
| Original Packaging | Reel with 650 pieces |
Compliance
| RoHS conform | Yes |
| HTSUS | 8504.40.9580 |
| SVHC free | Yes |
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