METAL FILM OVER FOAM CONTACTS | Laird Technologies EMI
Images may differ
Unit Price ($ / pc.)
0.20685 $
*
Available: 591 pcs.
Next delivery: 11361 pcs.
Manufacturer Leadtime: 9 Weeks **
Description
The 67SLG100100100PI00 is a common industry RFI and EMI - Contacts, Fingerstock and Gaskets housed in a RoHS compliant Standar package by Laird Technologies EMI made. The 67SLG100100100PI00 is using SPQ 300 pieces and MSL1 packing size. Buy new and original item from Innovo Technology distributor, contact by email: sales@hk-innovo.com
Technical specifications
Mfr | Laird Technologies EMI |
Series | SMD Grounding Metallized |
Package | Tape & Reel (TR) |
Product Status | Active |
Type | Film Over Foam |
Shape | Rectangle |
Width | 0.394" (10.00mm) |
Length | 0.394" (10.00mm) |
Height | 0.394" (10.00mm) |
Material | Polyurethane Foam, Tin-Copper Polyester (SN/CU) |
Plating | - |
Plating - Thickness | - |
Attachment Method | Solder |
Operating Temperature | -40°C ~ 70°C |
Shelf Life Start | Date of Shipment |
Shelf Life | 24 Months |
Storage/Refrigeration Temperature | - |
Logistics
Country of origin | HK |
Customs tariff number | - |
Original Packaging | Reel with 300 pieces |
Compliance
RoHS conform | Yes |
HTSUS | 8504.40.9580 |
SVHC free | Yes |
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