SP,CON,3,AU,TNR 7X2.5X4.8MM | Laird Technologies EMI

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MPN: 67B3G2504807010R0B

ManufacturerLaird Technologies EMI
Innovo Part NO.67B3G2504807010R0B_9085028
SeriesB3G
Package / CaseStandar
SPQ.750
Moisture Sensitivity LevelMSL 1
CertificateCE, CCC, ROHS
Product StatusAvailable
CategoriesRF and Wireless >> RFI and EMI - Contacts, Fingerstock and Gaskets
Technical specifications Download Datasheet
Unit Price ($ / pc.)
0.49303 $ *
Available: 958 pcs.
Next delivery: 19068 pcs.
Available in 9 Weeks
Manufacturer Leadtime: 16 Weeks **
Quantity
Price per unit*
100 pcs.
0.468379 $
500 pcs.
0.443727 $
1000 pcs.
0.419076 $
3000 pcs.
0.394424 $
10000 pcs.
0.369773 $
*incl. VAT plus shipping costs
**Subject to prior sale
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Description
Technical specifications
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Logistics
Compliance
Description

The 67B3G2504807010R0B is a common industry RFI and EMI - Contacts, Fingerstock and Gaskets housed in a RoHS compliant Standar package by Laird Technologies EMI made. The 67B3G2504807010R0B is using SPQ 750 pieces and MSL1 packing size. Buy new and original item from Innovo Technology distributor, contact by email: sales@hk-innovo.com

Technical specifications
MfrLaird Technologies EMI
SeriesB3G
PackageBulk
Product StatusActive
TypeFingerstock
Shape-
Width0.098 (2.50mm)
Length0.189 (4.80mm)
Height0.276 (7.00mm)
MaterialBeryllium Copper
PlatingGold
Plating - Thickness-
Attachment MethodSolder
Operating Temperature-
Shelf Life Start-
Shelf Life12 Months
Storage/Refrigeration Temperature50°F ~ 77°F (10°C ~ 25°C)
Logistics
Country of originHK
Customs tariff number-
Original PackagingReel with 750 pieces
Compliance
RoHS conformYes
HTSUS8504.40.9580
SVHC freeYes