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About LTM8055IY#PBF description and package details

Part Number: LTM8055IY#PBF
Manufacturer: Analog Devices Inc.
Package: 121-BBGA Module
Product link: https://www.hk-innovo.com/components-922-5216055-0.html

Product Details
The LTM8055 is a 36VIN, buck-boost µModule® (micromodule) regulator. Included in the package are the switching controller, power switches, inductor and support components. A resistor to set the switching frequency, a resistor divider to set the output voltage, and input and output capacitors are all that are needed to complete the design. Other features such as input and output average current regulation may be implemented with just a few components. The LTM8055 operates over an input voltage range of 5V to 36V, and can regulate output voltages between 1.2V and 36V. The SYNC input and CLKOUT output allow easy synchronization.

12VOUT from 5VIN to 36VIN Buck-Boost Regulator
Features
  • Complete Buck-Boost Switch Mode Power Supply
  • VOUT Equal, Greater, Less Than VIN
  • Wide Input Voltage Range: 5V to 36V
  • 12V/3A Output from 6VIN
  • 12V/6A Output from 12VIN
  • 12V/8.5A Output from 24VIN
  • Up to 97.5% Efficient
  • Adjustable Input and Output Average Current Limits
  • Input and Output Current Monitors
  • Parallelable for Increased Output Current
  • Wide Output Voltage Range: 1.2V to 36V
  • Selectable Switching Frequency: 100kHz to 800kHz
  • Synchronization from 200kHz to 700kHz

Maximum Output Current and Efficiency vs VIN
 

Package Details
The LTM8055 is housed in a compact overmolded ball grid array (BGA) package suitable for automated assembly by standard surface mount equipment.
15 × 15mm × 4.92mm BGA Pin and Function Compatible.

         Product Package 1

Original Packing Details
The LTM8055IY#PBF packs by vacuum packing with MSL3 (Moisture Sensitivity Level), components at this level are moderately sensitive to moisture and have a limited floor life.

Original Box and label outside:


Original vacuum packing and label:

 

μModule LGA and BGA Packaging Care and Assembly Instructions
Every original package will has the packaging care and assembly instructions inside.




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About LTM8055IY#PBF description and package details
The LTM8055 is housed in a compact overmolded ball grid array (BGA) package suitable for automated assembly by standard surface mount equipment. The LTM8055 is RoHS compliant.